Diethoxymethylsilane

CAS # : 2031-62-1
Synonym : DEMS

Technical specs :

Purity, By GC: ≥99.95%; Specification, By ICP-MS: ≥99.9999995%; TMI ≤5ppb

Industry/application :

Precursor for semiconductor low-k layers, moisture-proof insulating coatings for electronic components, hydrophobic coatings for optical glass and synthetic raw material of organosilicon resin for LED packaging, high-end silane modifier for electronic packaging.

Certifications :

ISO,COA,MSDS,TDS

PDF files :

Product Overview

High-purity organosilicon intermediate methyldiethoxysilane with high purity and low moisture impurities. Its hydrolysis reaction is mild and controllable to form flat films with methyl hydrophobicity, suitable for preparation systems of low-k organosilicon thin films.

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